Title:
IVH MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/199336
Kind Code:
A1
Abstract:
This IVH multilayer substrate (1) comprises: a multilayer body (4) in which a plurality of conductive layers (2) are laminated with insulating layers (3) therebetween; a blind via hole (5) extending from the front surface on one side of the multilayer body (4) to the rear surface on the other side; a plating film (7) formed on the wall surface of the blind via hole (5); a filler (8) filled into the inner side of the plating film (7); a protrusion (8a) formed by the filler (8) and protruding toward the rear surface of the multilayer body (4) beyond the distal end of the blind via hole (5); and solder resist (9) which covers the protrusion (8a) and is disposed toward the rear surface of the multilayer body (4) from the distal end of the blind via hole (5).
Inventors:
NAYA SHIGERU (JP)
HARADA HIROSHI (JP)
TAKAGI TSUYOSHI (JP)
HARADA HIROSHI (JP)
TAKAGI TSUYOSHI (JP)
Application Number:
PCT/JP2020/014922
Publication Date:
October 07, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H05K3/46
Foreign References:
| JP2015018900A | 2015-01-29 | |||
| JPH10322027A | 1998-12-04 |
Attorney, Agent or Firm:
ARAI, Shigeto (JP)
Download PDF: