Title:
JIG STAND
Document Type and Number:
WIPO Patent Application WO/2020/178949
Kind Code:
A1
Abstract:
Provided is a jig stand that can omit a mold release treatment step in a process for molding a fiber-reinforced plastic laminate. A mold release film 40 is bonded to the surface of a jig stand 30. The mold release film 40 is formed by bonding an FEP film 41 and a silicon-based adhesive film 42. It is preferable that the mold release film 40 be thin (100 μm or less). The mold release film 40 is suitable for the jig stand 30 having a free surface. In general, the existing jig stand 30 is made of metal. The thin mold release film 40 is stretchable and can thus be bonded to the free surface of the jig stand 30 while suppressing the occurrence of wrinkles. The thin mold release film 40 does not affect the product shape accuracy. The thickness of the mold release film 40 is uniform as compared to the case of applying a conventional mold releasing agent. In an overall product manufacturing process, mold release treatment and cleaning can be omitted. As a result, the overall product manufacturing process for the fiber-reinforced plastic laminate can be simplified.
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Inventors:
UCHIO TOYOHISA (JP)
Application Number:
PCT/JP2019/008400
Publication Date:
September 10, 2020
Filing Date:
March 04, 2019
Export Citation:
Assignee:
NIPPI CORP (JP)
International Classes:
B29C70/44
Domestic Patent References:
| WO2013147224A1 | 2013-10-03 |
Foreign References:
| JP2019502573A | 2019-01-31 | |||
| US9511520B1 | 2016-12-06 | |||
| JP2018176716A | 2018-11-15 | |||
| JP2018176695A | 2018-11-15 | |||
| JP2013147026A | 2013-08-01 |
Attorney, Agent or Firm:
MAEJIMA Daigo et al. (JP)
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