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Title:
JOINING MATERIAL, METHOD FOR MANUFACTURING JOINING MATERIAL, JOINING METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/060126
Kind Code:
A1
Abstract:
A metal fine particle powder having an average primary particle diameter of 150 nm or less, a metal large particle powder having a volume-based cumulative 90% particle diameter (D90) of 7-30 µm measured by a laser-diffraction particle size analyzer.

Inventors:
ENDOH KEIICHI (JP)
Application Number:
PCT/JP2020/035203
Publication Date:
April 01, 2021
Filing Date:
September 17, 2020
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F7/08; H01B1/22; H01B13/00; B22F1/102; B22F9/24
Domestic Patent References:
WO2015122251A12015-08-20
WO2013002407A12013-01-03
WO2019026799A12019-02-07
WO2013058291A12013-04-25
Foreign References:
JP2019055414A2019-04-11
JP2013191620A2013-09-26
JP2017514020A2017-06-01
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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