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Patent Searching and Data


Title:
JOINING STRUCTURE FOR RUBBER-CORED STRING, AND SOLIDIFIER FOR JOINING RUBBER-CORED STRING
Document Type and Number:
WIPO Patent Application WO/2018/110698
Kind Code:
A1
Abstract:
Provided is a joining structure in which joining strength is high compared with conventional joining structures for rubber-cored string in a rubber ring. Also provided is a solidifier for joining a rubber-cored string that provides such a joining structure. In this joining structure 2 for a rubber-cored string 11, both ends of the rubber-cored string 11 are brought together, or the ends of two rubber-cored strings are brought together, and joined with an adhesive. A solidified portion 23 is formed by a solidified solidifier 25 at both ends of the rubber-cored string 11, or at the ends of the two rubber-cored strings, and the solidified portion 23 includes porous particles. This solidifier 25 is caused to adhere to the rubber-cored string 11, and includes a solvent containing a solidifying component and porous particles added to the solvent.

Inventors:
OOTANI TAKESABUROU (JP)
EBOSHIDA AKIRA (JP)
TATSUMI YOSHINORI (JP)
Application Number:
PCT/JP2017/045129
Publication Date:
June 21, 2018
Filing Date:
December 15, 2017
Export Citation:
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Assignee:
EIKO ENTPR CO LTD (JP)
International Classes:
A45D8/36; B29C65/48; B65D63/10; D04C1/12
Foreign References:
JP2005040173A2005-02-17
JP2014090953A2014-05-19
JPH10291558A1998-11-04
JP2016034317A2016-03-17
JPH08308628A1996-11-26
JP2007224310A2007-09-06
Other References:
See also references of EP 3453283A4
Attorney, Agent or Firm:
MARUYAMA & CO. (JP)
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