Title:
LAMELLA MOUNTING METHOD, AND ANALYSIS SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/162863
Kind Code:
A1
Abstract:
Provided is a lamella mounting method with which an improvement in transport throughput can be achieved. This lamella mounting method includes: (a) a step of using nano-tweezers 62 to grip a lamella 10 fabricated on a portion of a wafer 1, to extract the lamella 10 from the wafer 1; and (b) a step of bringing the lamella 10 into close contact with a film 22 contained in a mesh 20 by moving the nano-tweezers 62, while the lamella 10 is being gripped by the nano-tweezers 62, in such a way as to press the lamella 10 against the film 22. After step (b), the lamella 10 is in close contact with the film 22 in such a way that an analysis region 11 faces the film 22.
Inventors:
TAN WEI CHEAN (JP)
KAWANISHI SHINSUKE (JP)
NOMAGUCHI TSUNENORI (JP)
CHIBA HIROYUKI (JP)
KAWANISHI SHINSUKE (JP)
NOMAGUCHI TSUNENORI (JP)
CHIBA HIROYUKI (JP)
Application Number:
PCT/JP2021/003203
Publication Date:
August 04, 2022
Filing Date:
January 29, 2021
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01N1/28; H01J37/20; H01L21/66
Foreign References:
| JP2002333387A | 2002-11-22 | |||
| JP2010507783A | 2010-03-11 | |||
| US20190017904A1 | 2019-01-17 | |||
| JP2003194681A | 2003-07-09 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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