Title:
LAMINATE FOR SEMI-ADDITIVE MANUFACTURING AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/097482
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a flat laminate for semi-additive manufacturing which is used for interfacial connection and exhibits a high degree of adhesion between a substrate and a conductor circuit without the use of a vacuum device and without requiring surface roughening by means of chromic acid or permanganic acid or requiring the formation of a surface modification layer by means of an alkali, said laminate making it possible to form wiring having a rectangular cross-sectional shape that is suitable for circuit wiring with little undercutting and good design reproducibility; and a printed wiring board using the same. The present invention is the result of the discovery that by using a laminate in which a conductive silver particle layer (M1) and a releasable cover layer (RC) are sequentially laminated on both surfaces of an insulating substrate (A), it is possible to form a printed wiring board having connected faces which exhibits a high degree of adhesion between a substrate and a conductor circuit without the use of a vacuum device and without requiring complicated surface roughening or the formation of a surface modification layer, and which has a rectangular cross-sectional shape that is suitable for circuit wiring with little undercutting and good design reproducibility.
Inventors:
FUKAZAWA NORIMASA (JP)
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
Application Number:
PCT/JP2021/038870
Publication Date:
May 12, 2022
Filing Date:
October 21, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B15/08; H05K3/18; H05K3/42
Domestic Patent References:
| WO2020003877A1 | 2020-01-02 |
Foreign References:
| JP2013136821A | 2013-07-11 | |||
| JP2000114693A | 2000-04-21 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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