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Patent Searching and Data


Title:
LAMINATED FILM, PACKAGING BAG, PACKAGE, AND METHOD FOR MANUFACTURING LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2022/080039
Kind Code:
A1
Abstract:
This laminated film is obtained by laminating, in the following order: a predetermined layer; an adhesion layer containing an adhesive component and polyvalent metal particles or polyvalent metal compound particles mixed with the adhesive component; and a sealant layer, wherein the scale factor of the maximum diameter of an aggregate, which is formed from the polyvalent metal particles or polyvalent metal compound particles, to the minimum diameter of the aggregate is at most 14.0-fold.

Inventors:
SHIMIZU KOSUKE (JP)
HORIUCHI MASAFUMI (JP)
OKUYAMA SATORU (JP)
MORITA MACHIKO (JP)
Application Number:
PCT/JP2021/032821
Publication Date:
April 21, 2022
Filing Date:
September 07, 2021
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
B32B7/023; B32B27/00; B32B7/12; B32B27/20; B65D30/02; B65D65/40; B65D85/50
Foreign References:
JP2019019206A2019-02-07
JP2018024816A2018-02-15
JP2017094533A2017-06-01
JP2012207039A2012-10-25
JPS6447533A1989-02-22
JP2013018551A2013-01-31
JP2020174465A2020-10-22
JP2020213930A2020-12-23
JP2021103474A2021-07-15
JP2021103478A2021-07-15
JP2021103481A2021-07-15
JP2014061682A2014-04-10
JP2017094533A2017-06-01
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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