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Patent Searching and Data


Title:
LAMINATED LENS STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/139253
Kind Code:
A1
Abstract:
To make it possible to restrain generation of chipping or cracking in a substrate of a laminated lens structure. A laminated lens structure includes substrates with lens which each have a lens disposed inside a through-hole formed in the substrate and which are laminated on one another by direct bonding, in which the substrates are each provided in the vicinity of the outer circumference thereof with through grooves penetrating the substrate. The present technology is applicable, for example, to a compound eye camera module.

Inventors:
YAMAMOTO ATSUSHI (JP)
TAKIMOTO KAORI (JP)
Application Number:
PCT/JP2018/000934
Publication Date:
August 02, 2018
Filing Date:
January 16, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B3/00; B29D11/00
Domestic Patent References:
WO2008096822A12008-08-14
WO2017022193A12017-02-09
WO2011010739A12011-01-27
Foreign References:
US20100079635A12010-04-01
US20100283113A12010-11-11
US20110211105A12011-09-01
US20110115058A12011-05-19
US20100321802A12010-12-23
US20130003199A12013-01-03
JP2011138089A2011-07-14
US20080121784A12008-05-29
US20110249350A12011-10-13
JP2009279790A2009-12-03
JP2011138089A2011-07-14
JP2010256563A2010-11-11
JP2013001091A2013-01-07
JP2010204631A2010-09-16
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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