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Patent Searching and Data


Title:
LAMINATED PAPER FOR MOLDING
Document Type and Number:
WIPO Patent Application WO/2004/028802
Kind Code:
A1
Abstract:
A laminated paper for molding which comprises a paper base having fine recesses and protrusions and having elongation characteristics imparted thereto due to the fine recesses and protrusions and, superposed on at least one surface of the base, one or more layers of a thermoplastic synthetic resin, wherein the recesses of the paper base surface have been filled with the thermoplastic synthetic resin so that the average sectional area of voids is smaller than 0.1 mm2.

Inventors:
OOGIMOTO MASATO (JP)
KATO MASATSUGU (JP)
OGAWA HIDENORI (JP)
Application Number:
PCT/JP2003/012471
Publication Date:
April 08, 2004
Filing Date:
September 30, 2003
Export Citation:
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Assignee:
JUJO PAPER CO LTD (JP)
KAWASAKI HIDEICHI (JP)
HATOH NOBUHIRO (JP)
OOGIMOTO MASATO (JP)
KATO MASATSUGU (JP)
OGAWA HIDENORI (JP)
International Classes:
B32B29/00; D21H27/28; (IPC1-7): B32B27/10
Domestic Patent References:
WO1996003281A11996-02-08
WO1996031647A11996-10-10
Foreign References:
JP2000296588A2000-10-24
JPH1029255A1998-02-03
JP2000289164A2000-10-17
JPH05138829A1993-06-08
JPH09193323A1997-07-29
Attorney, Agent or Firm:
Otsuka, Akihiro (Sumito Bldg. 1-5, Iwamoto-cho 3-chom, Chiyoda-ku Tokyo, JP)
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