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Patent Searching and Data


Title:
LAMINATED RESIN
Document Type and Number:
WIPO Patent Application WO/2001/058686
Kind Code:
A1
Abstract:
A multilayered molding which has an outer layer made of a polyamide resin and has excellent interlaminar adhesion, especially a multilayered molding further having an inner layer comprising a fluororesin; and a layered resin from which the multilayered molding can be produced. The laminated resin comprises a layer (A) made of a polyamide resin and a layer (B) made of a fluoroethylene polymer superposed on the layer (A), wherein the polyamide resin has an amine value of 10 to 60 eq/10?6¿ g and the fluoroethylene polymer has carbonyl groups.

Inventors:
INABA TAKESHI (JP)
KATO TAKETO (JP)
SAGISAKA SHIGEHITO (JP)
ARASE TAKUYA (JP)
SHIMIZU TETSUO (JP)
Application Number:
PCT/JP2001/000985
Publication Date:
August 16, 2001
Filing Date:
February 13, 2001
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
INABA TAKESHI (JP)
KATO TAKETO (JP)
SAGISAKA SHIGEHITO (JP)
ARASE TAKUYA (JP)
SHIMIZU TETSUO (JP)
International Classes:
B32B27/08; (IPC1-7): B32B27/30; B32B27/34; F16L11/04
Domestic Patent References:
WO1999045044A11999-09-10
Foreign References:
JPH10311461A1998-11-24
JPH09194815A1997-07-29
JPH10323953A1998-12-08
JPH08252891A1996-10-01
Other References:
See also references of EP 1270208A1
Attorney, Agent or Firm:
Yasutomi, Yasuo (Nishinakajima 5-chome Yodogawa-ku Osaka-shi, Osaka, JP)
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