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Patent Searching and Data


Title:
LAMINATION MOLDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/054127
Kind Code:
A1
Abstract:
A lamination molding system according to one embodiment comprises a lamination molding unit, a measuring unit, and a control unit. The lamination molding unit forms a plurality of layers to mold an object including the plurality of layers. The measuring unit measures the state of each of the layers. The control unit includes a storage unit and an estimation unit. The storage unit stores reference information based on: internal defect information indicating defects present inside a sample object on the basis of electromagnetic waves transmitted through the sample object, which is molded by the lamination molding unit and includes the plurality of layers; and sample measurement information indicating the measurement results of the plurality of layers of the sample object measured by the measuring unit. The estimation unit estimates whether or not a defect occurs inside the object, on the basis of the reference information and the measurement information indicating the measurement results of the plurality of layers of the object measured by the measuring unit.

Inventors:
MORIMATSU DAISUKE (JP)
FUJIMAKI SHIMPEI (JP)
Application Number:
PCT/JP2020/033344
Publication Date:
March 25, 2021
Filing Date:
September 02, 2020
Export Citation:
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Assignee:
SHIBAURA MACHINE CO LTD (JP)
International Classes:
B22F3/105; B22F3/16; B29C64/209; B29C64/268; B29C64/386; B33Y30/00; B33Y50/00; G01N25/72
Foreign References:
CN109855578A2019-06-07
JP2018020309A2018-02-08
JP2019142184A2019-08-29
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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