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Patent Searching and Data


Title:
LAMP STRIP SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND FINISHED LAMP STRIP
Document Type and Number:
WIPO Patent Application WO/2021/232302
Kind Code:
A1
Abstract:
The present application relates to the technical field of circuit boards. Provided are a lamp strip substrate and a manufacturing method therefor, and a finished lamp strip. The lamp strip substrate is divided into two portions and comprises a circuit substrate and a carrier substrate, the circuit substrate and the carrier substrate are separately manufactured, the circuit substrate comprises a first circuit layer, and the first circuit layer is configured to mount a small-sized light-emitting chip, thereby being capable of satisfying a mounting requirement of the small-sized light-emitting chip; moreover, the carrier substrate having a low manufacturing cost is used as the base of the lamp strip substrate, and the carrier substrate is used to electrically connect the circuit substrate, thereby being capable of separately controlling the accuracy of the circuit substrate while reducing the cost, and further ensuring the electrical function of the circuit substrate having the first circuit layer. Therefore, the present application at least can solve one of the problems in the prior art that the whole manufacturing cost of the lamp strip substrate is high and the electrical function is poor.

Inventors:
PENG, Shengqin (CN)
ZHONG, Yun (CN)
Application Number:
PCT/CN2020/091351
Publication Date:
November 25, 2021
Filing Date:
May 20, 2020
Export Citation:
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Assignee:
SHENZHEN SINGSUN TECHNOLOGY CO., LTD. (CN)
International Classes:
F21S4/24
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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