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Title:
LAPPING CONTROL METHOD AND APPARATUS, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2022/077924
Kind Code:
A1
Abstract:
A lapping control method, comprising the following steps: acquiring a target resistance value, set by a user, of a metal layer of a lapped object; determining a target output value of an eddy current sensor according to the target resistance value; and acquiring an output value of the eddy current sensor in real time, and when the output value reaches the target output value, stopping a lapping task. Also provided is a lapping control apparatus. By using the lapping control method, accurate control over a lapping time of a metal layer of a lapped object is realized, such that a resistance value of the metal layer of the lapped object after a CMP process is carried out is closer to a target resistance value, and the lapping precision is improved.

Inventors:
WANG JINGHAO (CN)
BAO YU (CN)
Application Number:
PCT/CN2021/097665
Publication Date:
April 21, 2022
Filing Date:
June 01, 2021
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
B24B37/00; B24B37/34; B24B37/005
Foreign References:
CN111571423A2020-08-25
CN108098565A2018-06-01
CN104511838A2015-04-15
CN106863104A2017-06-20
CN207120114U2018-03-20
JP2013107167A2013-06-06
TW201236812A2012-09-16
US20090096446A12009-04-16
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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