Title:
LASER IRRADIATION HEAD AND LASER IRRADIATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/064971
Kind Code:
A1
Abstract:
This laser irradiation head is provided with: a semiconductor laser module including a semiconductor laser element and a lens; a heatsink having a refrigerant flow passage; and a first pipe connector to or from which a first pipe for supplying refrigerant to the flow passage can be attached or detached. The heatsink has an outer surface including a first area and a second area in an intersecting relationship with the first area. The semiconductor laser module is screwed to the heatsink in the first area. The first pipe connector is screwed to the heatsink in the second area.
Inventors:
FUJIHARA ATSUSHI (JP)
Application Number:
PCT/JP2021/031876
Publication Date:
March 31, 2022
Filing Date:
August 31, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L23/467; F21V29/503; F21V29/54; F21V29/56; F21V29/70; H01S5/024; H05K7/20
Domestic Patent References:
| WO2019009086A1 | 2019-01-10 | |||
| WO2019225128A1 | 2019-11-28 | |||
| WO2016063814A1 | 2016-04-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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