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Title:
LASER MACHINING DEVICE, LASER MACHINING SYSTEM, ROTATOR UNIT DEVICE, LASER MACHINING METHOD, AND PROBE CARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251381
Kind Code:
A1
Abstract:
Provided is a laser machining device capable of making holes with an accurate hole shape. The laser machining device comprises: a laser oscillation unit (11); a polarization rotator (13); a beam rotator (14); a converging optical system (15); a rotation drive unit (first motor (132), second motor (142)); and a control unit (18). The polarization rotator (13) includes a wavelength plate (131) and a first rotation mechanism (134), and the first rotation mechanism (134) is capable of rotating the wavelength plate (131). The beam rotator (14) includes an irradiation angle adjustment optical system and a second rotation mechanism (144), and the second rotation mechanism (144) is capable of rotating the irradiation angle adjustment optical system. The rotation drive unit supplies a rotation drive force to the first rotation mechanism (134) and the second rotation mechanism (144). The control unit (18) is capable of controlling a rotation speed ratio of the first rotation mechanism (134) and the second rotation mechanism (144), and a polarization state of a laser beam can be adjusted by controlling the rotation speed ratio.

Inventors:
NAKASHIBA SHINICHI (JP)
ENDO OSAMU (JP)
Application Number:
PCT/JP2021/021744
Publication Date:
December 16, 2021
Filing Date:
June 08, 2021
Export Citation:
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Assignee:
KATAOKA CORP (JP)
International Classes:
B23K26/062; B23K26/082; B23K26/382
Foreign References:
JP2019025486A2019-02-21
US6362454B12002-03-26
JP2009233714A2009-10-15
JP2020100120A2020-07-02
Other References:
See also references of EP 3954492A4
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
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