Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090918
Kind Code:
A1
Abstract:
A laser machining device that forms a modification region inside a peripheral edge section including a side surface of a target object, by irradiating laser light on to the target object. The laser machining device comprises: a support unit; a first irradiation unit; a travel mechanism that moves at least either the support unit or the first irradiation unit; and a control unit that controls the support unit, the first irradiation unit, and the travel mechanism. The first irradiation unit has a first light-converging section that converges and emits laser light. The control unit controls the support unit, the first irradiation unit, and the travel mechanism such that the modification region is formed inside the peripheral edge section in a state in which the optical axis of the first light-converging section is along a first direction intersecting a direction perpendicular to the surface.
Inventors:
KOREMATSU KATSUHIRO (JP)
SAKAMOTO TAKESHI (JP)
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2019/042635
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; H01L21/301
Domestic Patent References:
| WO2015052218A1 | 2015-04-16 |
Foreign References:
| JP2005294656A | 2005-10-20 | |||
| JP2013141701A | 2013-07-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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