Title:
LASER PROCESSING DEVICE AND METHOD FOR PROCESSING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2020/152796
Kind Code:
A1
Abstract:
This laser processing device is provided with: a placement table for placing a workpiece; a shaping optical system that shapes a laser beam so that an irradiation region of the laser beam has a rectangular shape having short sides and long sides in a mask configured to shield a portion of the laser beam, the shaping optical system being capable of changing a second irradiation width of the irradiation region in the direction parallel to the long sides independently of a first irradiation width of the irradiation region in a direction parallel to the short sides, and the shaping optical system being configured to be capable of moving the irradiation region in the direction parallel to the long sides; a projecting optical system configured to project a pattern of the mask onto the workpiece placed on the placement table; and a moving device configured to be capable of moving the irradiation region in the direction parallel to the short sides.
Inventors:
SHIMBORI MASASHI (JP)
Application Number:
PCT/JP2019/001971
Publication Date:
July 30, 2020
Filing Date:
January 23, 2019
Export Citation:
Assignee:
GIGAPHOTON INC (JP)
International Classes:
H01S3/00; B23K26/073; H05K3/00
Domestic Patent References:
| WO2018100638A1 | 2018-06-07 |
Foreign References:
| JPS6352786A | 1988-03-05 | |||
| JP2007273539A | 2007-10-18 | |||
| JP2002207167A | 2002-07-26 | |||
| JP2011216863A | 2011-10-27 | |||
| JPH10270312A | 1998-10-09 | |||
| JPH06177009A | 1994-06-24 | |||
| JPH04238686A | 1992-08-26 | |||
| US20100027570A1 | 2010-02-04 |
Attorney, Agent or Firm:
HOSAKA Nobuhisa (JP)
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