Title:
LASER PROCESSING MACHINE, PROCESSING METHOD, AND LASER LIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2020/166420
Kind Code:
A1
Abstract:
[Problem] To provide a laser processing machine that can be made compact, a processing method, and a laser light source. [Solution] This laser processing machine is provided with a laser light source, and an optical system. The laser light source comprises: a light-emitting body including a base board, and a bottom emission type vertical-cavity surface-emitting laser element which is provided on one surface of the base board and which emits exciting light from the other surface side of the base board; and a resonator which is disposed in contact with the light-emitting body on said other surface side of the base board, and which causes oscillation of pulsed laser light in response to the incidence of the exciting light. The optical system causes the pulsed laser light to contract, and radiates the same onto a workpiece.
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Inventors:
HIRANO GO (JP)
KAMATA MASANAO (JP)
KAMATA MASANAO (JP)
Application Number:
PCT/JP2020/004019
Publication Date:
August 20, 2020
Filing Date:
February 04, 2020
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
B23K26/064; G02F1/37; H01S3/00; H01S3/0941; H01S3/113; H01S5/022; H01S5/183; H01S5/42
Foreign References:
| JP2016076528A | 2016-05-12 | |||
| JP2007173393A | 2007-07-05 | |||
| JPH1084169A | 1998-03-31 | |||
| JP2018085469A | 2018-05-31 | |||
| US20130064262A1 | 2013-03-14 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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