Title:
LAYERED BODY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/070562
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a layered body having an excellent function for suppressing rise in temperature of a heat-generating body even if a deformation such as folding or bending has occurred, and an electronic device equipped with the layered body. This layered body comprises a heat dissipation sheet and a heat storing sheet having a phase change material.
Inventors:
MITSUI TETSURO (JP)
Application Number:
PCT/JP2020/034531
Publication Date:
April 15, 2021
Filing Date:
September 11, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/027; C09K5/06; C09K5/14; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| WO2015087620A1 | 2015-06-18 |
Foreign References:
| JP2018534791A | 2018-11-22 | |||
| KR20180105886A | 2018-10-01 | |||
| JP2019510380A | 2019-04-11 | |||
| JP2015020383A | 2015-02-02 | |||
| US20130264023A1 | 2013-10-10 | |||
| CN105828579A | 2016-08-03 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF: