Title:
LAYERED BODY FOR PACKAGING
Document Type and Number:
WIPO Patent Application WO/2022/054891
Kind Code:
A1
Abstract:
This layered body for packaging is characterized by: including a barrier film 1 in which an inorganic film 1b is formed on a surface of a thermoplastic resin film 1a, and an adhesive layer 3 which is disposed on the inorganic film 1b; and the adhesive layer 3 being formed of an epoxy adhesive.
Inventors:
YOSHIKAWA SEISHI (JP)
SHIBATA KOUKI (JP)
EBATA ATSUSHI (JP)
MAJIMA KENYA (JP)
SHIBATA KOUKI (JP)
EBATA ATSUSHI (JP)
MAJIMA KENYA (JP)
Application Number:
PCT/JP2021/033240
Publication Date:
March 17, 2022
Filing Date:
September 10, 2021
Export Citation:
Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
B32B27/00; B65D77/00
Domestic Patent References:
| WO2013161481A1 | 2013-10-31 | |||
| WO2017002753A1 | 2017-01-05 |
Foreign References:
| JP2013249070A | 2013-12-12 | |||
| JP2006161033A | 2006-06-22 | |||
| JP2016064610A | 2016-04-28 |
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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