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Patent Searching and Data


Title:
LAYERED BODY FOR PACKAGING
Document Type and Number:
WIPO Patent Application WO/2022/054891
Kind Code:
A1
Abstract:
This layered body for packaging is characterized by: including a barrier film 1 in which an inorganic film 1b is formed on a surface of a thermoplastic resin film 1a, and an adhesive layer 3 which is disposed on the inorganic film 1b; and the adhesive layer 3 being formed of an epoxy adhesive.

Inventors:
YOSHIKAWA SEISHI (JP)
SHIBATA KOUKI (JP)
EBATA ATSUSHI (JP)
MAJIMA KENYA (JP)
Application Number:
PCT/JP2021/033240
Publication Date:
March 17, 2022
Filing Date:
September 10, 2021
Export Citation:
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Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
B32B27/00; B65D77/00
Domestic Patent References:
WO2013161481A12013-10-31
WO2017002753A12017-01-05
Foreign References:
JP2013249070A2013-12-12
JP2006161033A2006-06-22
JP2016064610A2016-04-28
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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