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Title:
LAYERED BODY AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/049235
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a metal material that is applicable to a constituent member of a semiconductor production device and has excellent corrosion resistance, and in particular, corrosion resistance with respect to acids. The layered body according to the present invention comprises a metal base material, a first nickel-containing plating coat layer formed over the metal base material, a gold plating coat layer formed over the first nickel-containing plating coat layer, a second nickel-containing plating coat layer formed over the gold plating coat layer, and a nickel fluoride coat layer formed over the second nickel-containing plating coat layer.

Inventors:
FURUYA AKIRA (JP)
KOJIMA TADAAKI (JP)
SUZUKI HIROSHI (JP)
NAKA FUMIAKI (JP)
Application Number:
PCT/JP2020/030620
Publication Date:
March 18, 2021
Filing Date:
August 11, 2020
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
B32B15/01; C23C8/02; C23C8/08; C23C18/18; C23C18/36; C23C18/42; C23C18/52; C23C28/00
Domestic Patent References:
WO2018232162A12018-12-20
Foreign References:
JP2008056978A2008-03-13
JP2010037603A2010-02-18
JP2010077529A2010-04-08
JP2001234360A2001-08-31
JP2018138687A2018-09-06
JP2013127115A2013-06-27
JPH10256708A1998-09-25
JP2007287362A2007-11-01
JP2954716B21999-09-27
JP3094000B22000-10-03
JP2004360066A2004-12-24
JP2581021B21997-02-12
Other References:
See also references of EP 4029689A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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