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Patent Searching and Data


Title:
LEAD-FREE AND ANTIMONY-FREE SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2021/161953
Kind Code:
A1
Abstract:
Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint capable of suppressing fusion failure as a result of having improved shear strength, which is attributed to the refinement of crystal grains at junction interfaces. This lead-free and antimony-free solder alloy has an alloy composition comprising, in terms of mass percentage, 0.1-4.5% of Ag, 0.20-0.85% of Cu, 0.005-0.090% of Ni, and 0.0005-0.0090% of Ge, the balance being Sn. The alloy composition satisfies formulas (1) and (2). (1): 0.006 ≤ (Ag + Cu + Ni) × Ge < 0.023 (2): (Sn/Cu) × (Ni × Ge) / (Ni + Ge) < 0.89 In the formulas (1) and (2), Ag, Cu, Ni, Ge, and Sn represent respective contents in the alloy composition (mass%).

Inventors:
IIJIMA YUUKI (JP)
YOSHIKAWA SHUNSAKU (JP)
SAITO TAKASHI (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
Application Number:
PCT/JP2021/004570
Publication Date:
August 19, 2021
Filing Date:
February 08, 2021
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26
Foreign References:
JP6241477B22017-12-06
JP2002020807A2002-01-23
JP5030442B22012-09-19
JP5633837B22014-12-03
JP6700568B12020-05-27
Attorney, Agent or Firm:
KENMOTSU Hidetaka (JP)
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