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Title:
LEAD-FREE AND ANTIMONY-FREE SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2021/161954
Kind Code:
A1
Abstract:
Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint in which crystal grains at a joining interface are micronized, thereby improving shear strength and making it possible to suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition containing, in terms of mass%, 0.1-4.5% of of Ag, 0.20-0.85% of Cu, 0.2-5.00% of Bi, 0.005-0.09% of Ni, and 0.0005-0.0090% of Ge, with the balance being Sn. The alloy composition satisfies the following formulas (1) and (2). Formula (1): 0.013≤(Ag+Cu+Ni+Bi)×Ge≤0.027 Formula (2): Sn×Cu×Ni≤5.0 In formulas (1) and (2), Ag, Cu, Ni, Bi, Ge, and Sn represent the element contents (mass%) for the respective elements of the alloy composition.

Inventors:
IIJIMA YUUKI (JP)
YOSHIKAWA SHUNSAKU (JP)
SAITO TAKASHI (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
Application Number:
PCT/JP2021/004571
Publication Date:
August 19, 2021
Filing Date:
February 08, 2021
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; C22C13/02
Foreign References:
JP2014217888A2014-11-20
JP5147409B22013-02-20
JP2002020807A2002-01-23
JP6700568B12020-05-27
Attorney, Agent or Firm:
KENMOTSU Hidetaka (JP)
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