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Patent Searching and Data


Title:
LEAK DETECTION SENSOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/050689
Kind Code:
A1
Abstract:
The present invention relates to a leak detection sensor manufacturing method and, specifically, to a leak detection sensor manufacturing method, which consecutively positions nonconductive and conductive layers, and then compresses same by means of a press, so that manufacturing is very easy while being inexpensive. To this end, the present invention comprises: a first step in which nonconductive molded products having a flat upper surface and lower surface are molded using a nonconductive powder; a second step in which conductive molded products having a flat upper surface and lower surface are molded using a conductive material; a third step in which the nonconductive molded products and the conductive molded products are alternately and vertically stacked on a mold; a fourth step in which pressure is vertically applied, using a press, to the stacked nonconductive molded products and conductive molded products to compress same, so that one compressed product is molded; a fifth step in which the compressed product having been molded is sintered; and a sixth step in which the side of the compressed product having been sintered is skived to have a predetermined thickness.

Inventors:
SEONG BAEK MYUNG (KR)
Application Number:
PCT/KR2021/011767
Publication Date:
March 10, 2022
Filing Date:
September 01, 2021
Export Citation:
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Assignee:
SEONG BAEK MYUNG (KR)
International Classes:
G01M3/16; B29C65/62; B29C70/34; B29C71/00; H01B1/24; H01B3/44; H01B5/14
Foreign References:
KR20150004273A2015-01-12
KR101830005B12018-02-19
KR20190001987A2019-01-08
US20070046481A12007-03-01
KR102273490B12021-07-06
Attorney, Agent or Firm:
WON, Eun Sup (KR)
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