LED DISPLAY AND ELECTRONIC APPARATUS COMPRISING SAME

WIPO Patent Application WO/2022/164189

A1

In a display device according to various embodiments of the present disclosure, the display device comprises: a printed circuit board (PCB) comprising a display driving circuit; and at least one micro LED package mounted on the display driving circuit, wherein the at least one micro LED package comprises: a flexible printed circuit board comprising a plurality of conductive vias; a plurality of LED devices connected on one surface of the FPCB; at least one connection pad arranged on the rear surface of the FPCB; and a conductive pattern formed on the FPCB to connect the plurality of LED devices and the connection pad through the plurality of conductive vias, and the conductive pattern may commonly connect, to any one of the at least one connection pad, the plurality of LED devices connected to a common signal line from among the plurality of LED devices comprising a plurality of pixels.

WO/2012/009919	LED INTEGRATED PACKAGING LIGHT SOURCE MODULE
JP5064639	A photoelectric component and a method for manufacturing the same, a module having a plurality of photoelectric components, and a device including such a module.
JP2005057272	LED MODULE

PARK TAESANG (KR)
KIM SOOHYUNG (KR)
HAN SANGTAE (KR)
AHN HUIGYEONG (KR)
KANG CHANGSUN (KR)
LEE KYOREE (KR)
JANG HYUNTAE (KR)
CHOI WON (KR)

PCT/KR2022/001365

August 04, 2022

January 26, 2022

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SAMSUNG ELECTRONICS CO LTD (KR)

H01L25/13; G09F9/302; H01L23/48; H01L33/38; H01L33/54; H01L33/56; H01L33/62

KR20190006430A	2019-01-18
CN111354867A	2020-06-30
KR20190109222A	2019-09-25
KR20180105834A	2018-10-01
US20170194541A1	2017-07-06

KWON, Hyuk-Rok et al. (KR)

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