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Title:
LIGHT EMISSION DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/166473
Kind Code:
A1
Abstract:
[Problem] To provide a light emission device and a manufacturing method therefor, with which a light emission element can be formed on a suitable substrate. [Solution] A light emission device of the present disclosure comprises: a first substrate; a plurality of light emission elements that are disposed on a first surface of the first substrate; and a second substrate that is disposed on a second surface of the first substrate which is on the side opposite the first surface.

Inventors:
SAITO SUGURU (JP)
YAMAMOTO YUICHI (JP)
FUJII NOBUTOSHI (JP)
TAKACHI TAIZO (JP)
Application Number:
PCT/JP2021/000257
Publication Date:
August 26, 2021
Filing Date:
January 06, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01S5/026; G02B3/00; H01L33/20; H01L33/58; H01S5/022; H01S5/42
Domestic Patent References:
WO2019043102A12019-03-07
Foreign References:
JP2019192889A2019-10-31
JP2016171303A2016-09-23
US20160164261A12016-06-09
JP2015111659A2015-06-18
JP2015031941A2015-02-16
JP2013541854A2013-11-14
US20120153306A12012-06-21
US20070071056A12007-03-29
JP2000022285A2000-01-21
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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