Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LIGHT-EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/110594
Kind Code:
A1
Abstract:
The present application relates to a light-emitting diode chip and a manufacturing method therefor, and a display device. The light-emitting diode chip comprises a light-transmitting substrate (105), an epitaxial layer (10), a first electrode (110), and a second electrode (109); the epitaxial layer (10) comprises a first semiconductor layer (101), a second semiconductor layer (103), and a light-emitting layer (102); the first semiconductor layer (101) is provided with an accommodating groove (20), a metal layer (30) is provided in the accommodating groove (20), and the metal layer (30) is in ohmic contact with the first semiconductor layer (101); the second semiconductor layer (103) is provided with an inclined groove (40), the light-transmitting substrate (105) is bonded to the first semiconductor layer (101), the first electrode (110) is provided in the inclined groove (40), and the second electrode (109) is provided on the second semiconductor layer (103).

Inventors:
WANG TAO (CN)
SHEN CHIA-HUI (CN)
WU KAI-YI (CN)
Application Number:
PCT/CN2021/083586
Publication Date:
June 02, 2022
Filing Date:
March 29, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)
International Classes:
H01L33/38
Foreign References:
CN101515621A2009-08-26
CN104362236A2015-02-18
CN107331679A2017-11-07
US20110114978A12011-05-19
US20070131958A12007-06-14
Attorney, Agent or Firm:
DHC IP ATTORNEYS (CN)
Download PDF: