Title:
LIQUID-APPLICATION DEVICE AND LIQUID-APPLICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2013/031048
Kind Code:
A1
Abstract:
This liquid-application device (1) is provided with the following: a substrate-supply unit (R1) containing substrate-supply magazines (5) that contain pre-application substrates (4); an application head (14) that applies a liquid (Q) to a substrate (4) that has been conveyed to a work position; and a substrate-collection unit (R2) containing substrate-collection magazines (5) that contain post-application substrates (4). The substrate-supply unit (R1) and the substrate-collection unit (R2) are positioned one above the other. This configuration makes it possible to reduce the size of this liquid-application device.
Inventors:
NONOMURA MASARU
ABE SEIKOU
ABE SEIKOU
Application Number:
PCT/JP2012/001711
Publication Date:
March 07, 2013
Filing Date:
March 13, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
NONOMURA MASARU
ABE SEIKOU
NONOMURA MASARU
ABE SEIKOU
International Classes:
B05C13/00; B05D3/00; H01L21/677
Domestic Patent References:
| WO2007066808A1 | 2007-06-14 |
Foreign References:
| JPH05186014A | 1993-07-27 | |||
| JPH07153720A | 1995-06-16 | |||
| JPS61144640U | 1986-09-06 | |||
| JPH0684972A | 1994-03-25 |
Attorney, Agent or Firm:
HASHIMOTO, Kimihide et al. (JP)
Kimihide Hashimoto (JP)
Kimihide Hashimoto (JP)
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