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Patent Searching and Data


Title:
LOCAL POLISHING METHOD, LOCAL POLISHING DEVICE, AND CORRECTIVE POLISHING APPARATUS USING SAID LOCAL POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/032106
Kind Code:
A1
Abstract:
[Problem] To provide a local polishing technique that stabilizes the volume of processing by means of local polishing, that can achieve a high level of corrective space resolution, and that is preferable for corrective polishing. [Solution] Press polishing is executed while a polishing solution, obtained by dispersing abrasive grains 81 comprising organic particles having an average particle diameter of at least 5 μm in a liquid, is being supplied to a space between a workpiece 9 and a workpiece-polishing rotary tool 11 that is to be locally pressed against the workpiece 9. The rotary tool 11 is composed of an elastic material.

Inventors:
MIMURA HIDEKAZU (JP)
HASHIZUME HIROKAZU (JP)
MATSUZAWA YUSUKE (JP)
Application Number:
PCT/JP2019/031137
Publication Date:
February 13, 2020
Filing Date:
August 07, 2019
Export Citation:
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Assignee:
UNIV TOKYO (JP)
NATSUME OPTICAL CORP (JP)
International Classes:
B24B37/00; B24B1/00; B24B37/005; C09K3/14
Domestic Patent References:
WO2015020082A12015-02-12
WO2015046542A12015-04-02
Foreign References:
JP2003300131A2003-10-21
JP2005177944A2005-07-07
JP2012056073A2012-03-22
US5591068A1997-01-07
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
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