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Patent Searching and Data


Title:
LOCATING APPARATUS AND METHOD FOR INTEGRATED CIRCUIT REPAIR
Document Type and Number:
WIPO Patent Application WO/2019/219094
Kind Code:
A2
Abstract:
Embodiments of the present application disclose a locating apparatus and method for integrated circuit repair. The integrated circuit repair apparatus comprises an infrared imaging and locating unit and an integrated circuit repair unit; the infrared imaging and locating unit is configured to locate, by means of a near infrared imaging method, failure points on an integrated circuit being tested; the integrated circuit repair unit is configured to repair the circuit at said failure points.

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Inventors:
ZHAO YANG (CN)
ZHU JINHUI (CN)
ZHANG HAIFENG (CN)
SUN CHENJUN (CN)
CHEN YANNING (CN)
ZHAO MINGMIN (CN)
LI JIANQIANG (CN)
YUAN YUANDONG (CN)
Application Number:
CN2019/094855
Publication Date:
November 21, 2019
Filing Date:
July 05, 2019
Export Citation:
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Assignee:
BEIJING SMARTCHIP MICROELECTRONICS TECH CO LTD (CN)
STATE GRID INFORMATION & TELECOMMUNICATION GROUP CO LTD (CN)
STATE GRID CORP CHINA (CN)
STATE GRID HEBEI ELECTRIC POWER CO LTD (CN)
CHINA ELECTRIC POWER RES INST CO LTD (CN)
International Classes:
H01L21/68; H01L21/66
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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