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Title:
LONG POLYIMIDE LAMINATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/170893
Kind Code:
A1
Abstract:
In view of the above, the present invention addresses the problem of providing a polyimide material which is capable of reliably providing a flexible printed circuit (FPC), wherein no misalignment occurs when the flexible printed circuit (FPC)is connected to other parts or circuit materials, even if the widths and intervals of wiring formed on the FPC are made extremely small. The problem can be solved by a polyimide laminate having a thermoplastic polyimide resin layer on at least one surface of a non-thermoplastic polyimide film, the polyimide laminate being characterized in that α and β are in the range of -2.1<α<0.1, -2.5<β<-0.5, and -0.1<α×β<6.0, where α is the heating-induced rate of change in the longitudinal dimensions of the film at the glass transition temperature of the laminate, and β is the heating-induced rate of change in the transverse dimensions of the film at the glass transition temperature.

Inventors:
HOSOGAI SEIJI (JP)
SAITO JUNPEI (JP)
FUKUSHIMA NAOKI (JP)
Application Number:
PCT/JP2017/013311
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/28; B32B7/02
Domestic Patent References:
WO2006033324A12006-03-30
WO2006011513A12006-02-02
WO2007029609A12007-03-15
Foreign References:
JP2008188954A2008-08-21
JP2008188778A2008-08-21
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
Masahito Shintaku (JP)
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