Title:
LOUDSPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2020/098102
Kind Code:
A1
Abstract:
Disclosed is a loudspeaker module, comprising a middle module housing and an upper module housing provided on the middle module housing. An injection-molded steel sheet is provided on the upper module housing; an in-built electrostatic charge removing structure is provided on the middle module housing; the electrostatic charge removing structure comprises a conductive plastic member and a metal insert connected with the conductive plastic member, and the metal insert is provided in the middle module housing by means of injection molding; the conductive plastic member is fixed on the middle module housing by means of secondary injection molding; the conductive plastic member is configured to be in conduction with an external device; the metal insert is connected with the injection-molded steel sheet. By mounting the conductive plastic member on the middle housing by means of injection molding, the present invention simplifies a product structure, optimizes a product appearance, achieves the purpose of removing electrostatic charges, and improves the yield rate of a product.
Inventors:
LI ZHENJUN (CN)
LI CHENGWEI (CN)
LI CHENGWEI (CN)
Application Number:
PCT/CN2018/124433
Publication Date:
May 22, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R1/02; H05F3/02
Foreign References:
| CN205142515U | 2016-04-06 | |||
| CN106794758A | 2017-05-31 | |||
| CN201150126Y | 2008-11-12 | |||
| CN207475806U | 2018-06-08 | |||
| US20160192463A1 | 2016-06-30 | |||
| JP4541171B2 | 2010-09-08 |
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