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Patent Searching and Data


Title:
LOUDSPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2021/232485
Kind Code:
A1
Abstract:
The present application provides a loudspeaker module, comprising a housing having an accommodation space, a loudspeaker unit accommodated in the accommodation space, and a circuit board provided outside the housing; the loudspeaker unit comprises elastic insertion pins for accessing external electrical signals; openings corresponding to the elastic insertion pins are provided on the housing; the circuit board is covered to the openings and is connected to the housing in a sealed mode; and the elastic insertion pins are exposed out of the housing by means of the openings and are electrically connected to the circuit board. In the present application, the circuit board is provided outside, reducing the occupied space inside the housing, reducing the volume of the loudspeaker module, and better sealing the housing by means of the external circuit board.

Inventors:
CHEN WEI (CN)
Application Number:
PCT/CN2020/093709
Publication Date:
November 25, 2021
Filing Date:
June 01, 2020
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (SG)
International Classes:
H04R9/06
Foreign References:
CN206865739U2018-01-09
CN104038856A2014-09-10
CN204442659U2015-07-01
CN109246557A2019-01-18
CN205545923U2016-08-31
CN110062314A2019-07-26
CN207099287U2018-03-13
US20110172001A12011-07-14
Attorney, Agent or Firm:
SHENZHEN CIPRUN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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