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Patent Searching and Data


Title:
MACHINE AND METHOD FOR BAKING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/113090
Kind Code:
A1
Abstract:
A machine (200) and method for baking a substrate (221). The machine (200) for baking the substrate (221) comprises a ring-shaped carrier body (250), a cover plate (251), an air input unit (230), an air extraction and output unit (240), and a discharge and regulation air extraction system (260). The ring-shaped carrier body (250) covers the substrate (221). The ring-shaped carrier body (250) and the cover plate (251) disposed thereon define a closed chamber (255). A surface of the substrate (221) is located within the closed chamber (255). The air input unit (230) and the air extraction and output unit (240) are respectively disposed at an input end (230) and an output end (240) of the closed chamber (255). The discharge and regulation air extraction system (260) is disposed above the cover plate (251), and communicated with the closed chamber (255) to regulate and discharge a large amount of vapor and gas evaporated from the substrate (221). The method for baking the substrate (221) comprises: providing the machine (200) for baking the substrate (221); heating the substrate (221) by means of a heating unit (220) to generate evaporated gas; and discharging the evaporated gas by means of the air input unit (230), the air extraction and output unit (240), and the discharge and regulation air extraction system (260).

Inventors:
HUANG CHUN-CHIN (CN)
Application Number:
PCT/CN2017/074911
Publication Date:
June 28, 2018
Filing Date:
February 26, 2017
Export Citation:
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Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CORPORATION LIMITED (CN)
International Classes:
H01L21/67; F26B3/06
Foreign References:
CN101008547A2007-08-01
US20020127509A12002-09-12
CN101055433A2007-10-17
CN103760696A2014-04-30
JPH06267840A1994-09-22
JP2006153315A2006-06-15
US20050244759A12005-11-03
Attorney, Agent or Firm:
BEIJING HUIZE INTELLECTUAL PROPERTY LAW LLC (CN)
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