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Title:
MACHINING LINE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/071134
Kind Code:
A1
Abstract:
Provided is a machining line system equipped with a plate material cutting device capable of cutting a plate material that has been machined by a machining device, so as to improve production efficiency. A machining line system 101 comprises: a machining device 102 for machining a plate material 105, a plate material feeding device 103 for intermittently transporting the plate material 105 to the machining device 102, and a plate material cutting device 104 provided with a cutter for cutting the plate material 105 machined by the machining device 102. The plate material cutting device 104 is configured so as to be able to drive the cutter in accordance with a process carried out by the machining device 102 on the plate material 105.

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Inventors:
HORI SHOGO (JP)
Application Number:
PCT/JP2021/035134
Publication Date:
April 07, 2022
Filing Date:
September 24, 2021
Export Citation:
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Assignee:
SANKYO SEISAKUSHO KK (JP)
International Classes:
B21D43/02; B21D43/28
Foreign References:
JP2020127956A2020-08-27
JPS6167938U1986-05-09
JPS478945Y11972-04-05
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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