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Patent Searching and Data


Title:
MACHINING METHOD EMPLOYING ORGANIC FINE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2021/066071
Kind Code:
A1
Abstract:
[Problem] To provide a machining method employing organic fine particles that can be used to manufacture, by means of elastic emission machining (EEM) processing, which has demonstrated excellent results, an optical element, or a glass substrate provided with a high precision surface, for use in an optical system having a wavelength band from the vacuum ultraviolet region to the hard X-ray region, that resolves the problem of agglomeration of the machining fine particles, and with which, even if the machining fine particles are attached to the surface of a workpiece after machining, the machining fine particles can easily be removed. [Solution] An EEM process for machining a workpiece employs a machining liquid in which machining fine particles (3) that are capable of adhering to a surface (2) of a workpiece (1) by means of a physiochemical interaction are dispersed in a solvent, causes the machining liquid to flow along the workpiece surface, and, by means of the shear flow of the machining liquid, removes the machining fine particles that have attached to the workpiece surface in a no-load state together with workpiece surface atoms that have bonded to the machining fine particles, wherein organic fine particles are used as the only solid material for the machining fine particles.

Inventors:
OKADA HIROMI (JP)
AONO SHINYA (JP)
TSUMURA TAKASHI (JP)
Application Number:
PCT/JP2020/037321
Publication Date:
April 08, 2021
Filing Date:
September 30, 2020
Export Citation:
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Assignee:
JTEC CORP (JP)
International Classes:
B24B31/00; B24C1/00; B24C11/00
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
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