Title:
MAGNETIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/141670
Kind Code:
A1
Abstract:
This magnetic device (1) is provided with the following: a core (2a); a multilayered substrate (3) that has openings (3m, 3L, 3r) through which the core is inserted (2a), one layer (L3) on the surface of the substrate (3), and a plurality of other layers (L1, L2); a coil pattern (4a through 4c) provided on each layer (L1 through L3) of the substrate (3) so as to wind around the core (2a); and through-holes (9a, 9b) that connect the coil patterns (4a through 4c) on different layers (L1 through L3) to each other. On the other layers (L1, L2) provided with coil patterns (4a, 4b), parts of said coil patterns (4a, 4b) are expanded so as to provide heat-dissipating sections (4t0 through 4t4). Said heat-dissipating sections (4t0 through 4t4) are laid out so as not to overlap in the plane of the substrate (3). The magnetic device (1) is also provided with heat-dissipating pins (7a through 7d) and through-holes (8d) that connect the respective heat-dissipating sections (4t0 through 4t4) to the third layer (L3).
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Inventors:
FURUI SHUSUKE (JP)
TAKEUCHI TOSHIYUKI (JP)
YAMAGUCHI TAKASHI (JP)
TAKEUCHI TOSHIYUKI (JP)
YAMAGUCHI TAKASHI (JP)
Application Number:
PCT/JP2014/001322
Publication Date:
September 18, 2014
Filing Date:
March 10, 2014
Export Citation:
Assignee:
OMRON AUTOMOTIVE ELECTRONICS (JP)
International Classes:
H01F37/00; H01F17/00; H01F17/04; H01F27/08; H01F27/22; H01F27/28; H05K1/02
Domestic Patent References:
| WO2011010491A1 | 2011-01-27 |
Foreign References:
| JP2007059839A | 2007-03-08 | |||
| JP2010161258A | 2010-07-22 | |||
| JP2010153724A | 2010-07-08 | |||
| JP2008502293A | 2008-01-24 | |||
| JP2013062355A | 2013-04-04 |
Attorney, Agent or Firm:
OKUMURA, HIDEYUKI (JP)
Hideyuki Okumura (JP)
Hideyuki Okumura (JP)
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