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Title:
MAGNETIC FLUID PUMP DEVICE FOR IGBT HEAT DISSIPATION AND TEST METHOD
Document Type and Number:
WIPO Patent Application WO/2021/036700
Kind Code:
A1
Abstract:
The present invention relates to the related field of IGBT heat dissipation, and provides a magnetic fluid pump device for IGBT heat dissipation and a test method. In the magnetic fluid pump device designed in the present invention, a liquid metal is used as a coolant, so that more heat can be absorbed than a common water cooling device, thereby providing better heat dissipation for an IGBT chip. Temperature and pressure change in an inlet pipeline and an outlet pipeline of a magnetic fluid pump can be monitored in real time by means of a temperature sensor and a pressure sensor, and temperature change of the IGBT chip can be observed in real time by means of a thermal imager. The test method for the magnetic fluid pump device for IGBT heat dissipation provided in the present invention is simple and easy to implement; positive and negative electrodes in the magnetic fluid pump are electrified under the action of a magnetic field so as to drive a magnetic fluid to flow; a water cooling apparatus can implement heat dissipation for the magnetic fluid in the magnetic fluid pump. According to the test method provided in the present invention, the heat dissipation effects of magnetic fluids at different flow rates on IGBT chips having different powers can be tested, and normal operation of the IGBT chip is guaranteed.

Inventors:
SONG XUEGUAN (CN)
LI KUNPENG (CN)
ZHOU CHANGAN (CN)
ZONG CHAOYONG (CN)
LI QINGYE (CN)
SUN WEI (CN)
Application Number:
PCT/CN2020/106578
Publication Date:
March 04, 2021
Filing Date:
August 03, 2020
Export Citation:
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Assignee:
UNIV DALIAN TECH (CN)
International Classes:
H01L23/367; G01D21/02; G01R31/26; H01L23/473; H02K44/02
Foreign References:
CN110534488A2019-12-03
CN109271008A2019-01-25
CN102426902A2012-04-25
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