Title:
MAGNETISM-SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/155888
Kind Code:
A1
Abstract:
The provision of a magnetism-sensor device wherein, without securing a large space around a magnet, the impact of inductive noise generated along a path along which output from a magnetism sensor is transmitted can be reduced. In this sensor device (10), a double-sided substrate (5) that has a magnetism sensor (4) mounted on one surface (501) and a semiconductor device (9) mounted on the other surface (502) is used, and said magnetism sensor (4) and semiconductor device (9) are electrically connected to each other via through-holes (50) in the double-sided substrate (5). The magnetism sensor (4) and the semiconductor device (9) are laid out such that at least parts thereof overlap in the thickness direction of the double-sided substrate (5), and the through-holes (50) are positioned so as to overlap both the magnetism sensor (4) and the semiconductor device (9) in the thickness direction of the double-sided substrate (5). This makes the transmission path from the magnetism sensor (4) to the semiconductor device (9) short, making inductive noise generated along the path along which output from the magnetism sensor (4) is transmitted small.
Inventors:
OKUMURA HIROKATSU (JP)
EBINE TORU (JP)
ODAGIRI HIDEYUKI (JP)
TSUNETA HARUHIRO (JP)
EBINE TORU (JP)
ODAGIRI HIDEYUKI (JP)
TSUNETA HARUHIRO (JP)
Application Number:
PCT/JP2013/084916
Publication Date:
October 02, 2014
Filing Date:
December 26, 2013
Export Citation:
Assignee:
NIDEC SANKYO CORP (JP)
International Classes:
G01D5/245
Foreign References:
| JP2012168016A | 2012-09-06 | |||
| JPS62158307U | 1987-10-07 | |||
| JP2004022729A | 2004-01-22 | |||
| JPH03102277A | 1991-04-26 | |||
| JP2007103556A | 2007-04-19 |
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