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Title:
MAIN SPINDLE DEVICE AND METHOD FOR ASSEMBLING SAME
Document Type and Number:
WIPO Patent Application WO/2022/154040
Kind Code:
A1
Abstract:
This main spindle device comprises a squeeze film damper having: a plurality of seal members spaced apart from one another in the axial direction of a main spindle and compressed and deformed between a bearing unit and a housing; and a viscous fluid between the plurality of seal members, the inner circumferential surface of the housing, and the outer circumferential surface of the bearing unit. The main spindle device further comprises a support member attached to the bearing unit. When elastically deformed, the support member makes contact with the inner circumferential surface of the housing. When not elastically deformed, the support member separates from the inner circumferential surface of the housing.

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Inventors:
OSANAI MASASHI (JP)
KASHIWABARA SHIN (JP)
ARIKABE TAKEO (JP)
Application Number:
PCT/JP2022/000867
Publication Date:
July 21, 2022
Filing Date:
January 13, 2022
Export Citation:
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Assignee:
KOMATSU MFG CO LTD (JP)
International Classes:
B23Q11/00; B23B19/02; F16C32/06; F16C43/00; F16J15/10
Foreign References:
JPS61133121U1986-08-20
JPS59175901A1984-10-05
JPH05277806A1993-10-26
JP2004299008A2004-10-28
JP2011235363A2011-11-24
JP2013204740A2013-10-07
JP2015004402A2015-01-08
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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