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Title:
MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2020/213639
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a maleimide resin which has a specific structure that brings about excellent heat resistance and excellent low-dielectric characteristics and which is suitable for use in encapsulating electrical/electronic components or in circuit boards, carbon fiber composite materials, etc.; a curable resin composition; and a cured object obtained therefrom.　The maleimide resin is represented by formula (1).　In formula (1), R represents a hydrocarbon group having 1-18 carbon atoms. m is an integer of 1-4 and n is an average value satisfying 1≤n≤20.

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Inventors:
TOHJIMA TAKAYUKI (JP)
HASEGAWA ATSUHIKO (JP)
Application Number:
PCT/JP2020/016559
Publication Date:
October 22, 2020
Filing Date:
April 15, 2020
Export Citation:
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Assignee:
NIPPONKAYAKU KK (JP)
International Classes:
C07D207/448; C08G14/02
Domestic Patent References:
WO2017170551A12017-10-05
Foreign References:
JPH03190914A1991-08-20
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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