Title:
MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/177209
Kind Code:
A1
Abstract:
Provided are a manufacturing method for an array substrate, and an array substrate. The manufacturing method for the array substrate comprises: forming a first metal layer on a substrate, wherein the first meal layer comprises multiple first metal wires and multiple intermittent second metal wires; forming interlayer dielectric insulating layers on the substrate and the first metal layer; and forming intermittent data wires on the interlayer dielectric insulating layers and the first metal layer, wherein the intermittent data wires are in contact with the intermittent second metal wires by means of a via.
More Like This:
| JP4083821 | Manufacturing method of semiconductor device |
| JP2016167615 | MANUFACTURING METHOD OF DISPLAY DEVICE |
| JP2005150686 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
Inventors:
AI FEI (CN)
SONG DEWEI (CN)
SONG DEWEI (CN)
Application Number:
PCT/CN2019/085162
Publication Date:
September 10, 2020
Filing Date:
April 30, 2019
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L21/84; H01L27/12
Foreign References:
| CN101661174A | 2010-03-03 | |||
| CN102411237A | 2012-04-11 | |||
| CN103730474A | 2014-04-16 | |||
| US20090261336A1 | 2009-10-22 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
Download PDF: