Title:
MASKING JIG, FILM FORMATION METHOD, AND FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/254945
Kind Code:
A1
Abstract:
A masking jig (1) whereby a film having stable quality can be efficiently formed on the surface of a substrate is provided with a body section (11) and a mask cover (12). The body section (11) includes a first surface (11s1) and a second surface (11s2) positioned on the reverse side from the first surface (11s1). The mask cover (12) is disposed on the second surface (11s2) side of the body section (11) so as to overlap the body section (11), and includes a third surface (12s1) and a fourth surface (12s2) positioned on the reverse side from the third surface (12s1). The mask cover (12) is formed from an imide-based resin.
Inventors:
HIRANO MASAKI (JP)
Application Number:
PCT/JP2022/016145
Publication Date:
December 08, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C23C24/04; B05B7/16; B05B12/20; C23C4/02
Domestic Patent References:
| WO2017057621A1 | 2017-04-06 |
Foreign References:
| JP2000231880A | 2000-08-22 | |||
| JP2009001873A | 2009-01-08 | |||
| JP2007234248A | 2007-09-13 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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