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Patent Searching and Data


Title:
MATERIAL PLACEMENT METHOD, CONTROL APPARATUS, DEVICE AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/134717
Kind Code:
A3
Abstract:
A material placement method, comprising: determining a target placement area, the target placement area being correspondingly provided with a target material storage apparatus (S10); determining a movement track according to a current placement area and the target placement area (S20); if each placement area which the movement track passes through is not reserved for occupancy, determining a material placement means according to a positional relationship between the movement track and the target material storage apparatus (S30); placing a material in the target material storage apparatus according to the determined material placement means (S40). During the material placement, the movement track is determined according to the current placement area and the target placement area, a determination is made as to whether each placement area which the movement track passes through is reserved for occupancy, and if no, the problem of collisions during the material placement is effectively avoided, and the safety of the material placement is increased. Also provided are a material placement control apparatus, a material placement device and a material placement system.

Inventors:
ZHANG HENG (CN)
ZHOU ZHETING (CN)
ZHOU JINGCHUN (CN)
Application Number:
PCT/CN2019/083386
Publication Date:
February 13, 2020
Filing Date:
April 19, 2019
Export Citation:
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Assignee:
SHANGHAI QUICKTRON INTELLIGENT TECH CO LTD (CN)
International Classes:
B65G65/00
Foreign References:
CN106829374A2017-06-13
CN109305502A2019-02-05
CN108838732A2018-11-20
CN106483889A2017-03-08
CN107450548A2017-12-08
CN108382783A2018-08-10
US20070059132A12007-03-15
Attorney, Agent or Firm:
CHANG TSI & PARTNERS (CN)
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