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Patent Searching and Data


Title:
MATERIAL SUPPLYING DEVICE, LAYERING FABRICATION DEVICE, AND MATERIAL SUPPLYING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/042807
Kind Code:
A1
Abstract:
 The material supplying device according to an embodiment of the present invention is provided with a supplying part. The supplying unit has an electrode part which can be electrically charged by application of a voltage thereto, and an insulating part for covering the electrode part, and the electrode part is configured so that by control of the electrical charge state thereof, a material is adsorbed on and separated from the surface of the insulating part.

Inventors:
KOBAYASHI KOTARO (JP)
NAKANO HIDESHI (JP)
OHNO HIROSHI (JP)
PAN SHANYING (JP)
TANAKA MASAYUKI (JP)
Application Number:
PCT/JP2015/057595
Publication Date:
March 24, 2016
Filing Date:
March 13, 2015
Export Citation:
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Assignee:
TOSHIBA KK (JP)
International Classes:
B29C67/00; B22F3/105; B28B1/16; B28B13/02
Foreign References:
JP2012028651A2012-02-09
JP2006289650A2006-10-26
JP2005186474A2005-07-14
JP2002347129A2002-12-04
JP2015066714A2015-04-13
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Sakai international patent firm (JP)
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