Title:
MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/085051
Kind Code:
A1
Abstract:
The present invention can provide a measurement device, a measurement method, and a bonding system, which enable estimation of the state of the underside of an electronic component that is mounted on a substrate. A measurement device 10 performs measurements on an electronic component 320 that is mounted on a main surface of a substrate 300, the measurement device comprising: a measurement unit 120 that measures a component height position, which is the height of the top surface of the electronic component 320, and a substrate height position, which is the height of a non-mount region of the main surface of the substrate 300 where the electronic component 320 is not mounted; and an estimation unit 114 that estimates position information relating to a mount region of the main surface of the substrate 300 where the electronic component 320 is mounted, on the basis of the component height position and the substrate height position as measured by the measurement unit 120.
Inventors:
YOSHIDA SHINICHI (JP)
Application Number:
PCT/JP2020/039286
Publication Date:
April 28, 2022
Filing Date:
October 19, 2020
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H05K13/04
Foreign References:
| JP2010186940A | 2010-08-26 | |||
| JPH0494552A | 1992-03-26 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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