Title:
MEASURING APPARATUS AND MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/163532
Kind Code:
A1
Abstract:
A measuring apparatus (1) is provided with a support stand (203) for mounting a printed wiring board (102), a load application device (201) for applying a load to the printed wiring board (102) mounted on the support stand, a presser (202) for pressing the printed wiring board (102) by means of the load applied from the load application device (201), and an acoustic emission (AE) sensor (301) for detecting a change that occurs in a ceramic electronic component (101) when the ceramic electronic component (101) is broken as a result of the printed wiring board (102) being pressed by the presser (202). The acoustic emission (AE) sensor (301) is configured so as to be attached to the surface of the printed wiring board (102) on which the ceramic electronic component (101) is packaged.
Inventors:
YAMAGAMI TAIJU (JP)
NOTSU YUKINARI (JP)
UEHARA KOKI (JP)
NOTSU YUKINARI (JP)
UEHARA KOKI (JP)
Application Number:
PCT/JP2022/002230
Publication Date:
August 04, 2022
Filing Date:
January 21, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01N3/20
Foreign References:
| JPH05235142A | 1993-09-10 | |||
| JPH03146843A | 1991-06-21 | |||
| JPH04299233A | 1992-10-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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