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Patent Searching and Data


Title:
MEMBER FOR SEMICONDUCTOR CLEANING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/079724
Kind Code:
A1
Abstract:
Provided is a member for a semiconductor cleaning apparatus, the member being less likely to be thermally deformed and cause metal to be eluted therefrom. The member for a semiconductor cleaning apparatus includes a prepreg in which a carbon fiber and a tetrafluoroethylene/perfluoro (alkyl vinyl ether) copolymer are thermally fused.

Inventors:
MURAKAMI, Shinji (Umeda Center Building, 4-12, Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-Sh, Osaka 23, JP)
YUKAWA, Hirokazu (Umeda Center Building, 4-12, Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-Sh, Osaka 23, JP)
HAGI, Keisuke (Umeda Center Building, 4-12, Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-Sh, Osaka 23, JP)
MASUI, Toshiaki (Umeda Center Building, 4-12, Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-Sh, Osaka 23, JP)
Application Number:
JP2020/037733
Publication Date:
April 29, 2021
Filing Date:
October 05, 2020
Export Citation:
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Assignee:
DAIKIN INDUSTRIES, LTD. (4-12 Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-Sh, Osaka 23, JP)
International Classes:
H01L21/304; B29C70/06
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, JP)
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