Title:
MEMS MICROPHONE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2011/081288
Kind Code:
A2
Abstract:
The present invention relates to a MEMS microphone having less residual stress at a contact portion between a silicon substrate and a membrane, and to a method for manufacturing the MEMS microphone. The MEMS microphone comprises: a silicon substrate in which a back chamber is formed; a back plate deposited on the silicon substrate and including a plurality of sound holes; a membrane deposited on the silicon substrate and spaced apart from the back plate to form an air gap; and a stress buffer deposited between the membrane and the silicon substrate.
Inventors:
KIM YONG-KOOK
Application Number:
PCT/KR2010/007535
Publication Date:
July 07, 2011
Filing Date:
October 29, 2010
Export Citation:
Assignee:
BSE CO LTD
KIM YONG-KOOK
KIM YONG-KOOK
International Classes:
H04R19/00; H04R19/04
Foreign References:
| JP2009148880A | 2009-07-09 | |||
| JP2006068843A | 2006-03-16 | |||
| KR100893558B1 | 2009-04-17 | |||
| KR20060099627A | 2006-09-20 |
Attorney, Agent or Firm:
YOON, Byung-Sam et al. (KR)
윤병삼 (KR)
윤병삼 (KR)
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