Title:
MEMS MICROPHONE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/080068
Kind Code:
A1
Abstract:
The present invention relates to a microphone package. The microphone package comprises: a substrate; a MEMS transducer located on the substrate and converting, into an electrical signal, a sound applied from the outside; a signal processing unit located on the substrate and processing and outputting the electrical signal input from the MEMS transducer; and a first bonding portion for adhering the MEMS transducer to the substrate and containing a plurality of additives therein, wherein the MEMS transducer is located above the plurality of additives.
Inventors:
YUN SANG YOUNG (KR)
MIN CHOL KYU (KR)
MIN CHOL KYU (KR)
Application Number:
PCT/KR2019/014627
Publication Date:
April 29, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
H01L25/065; H01L23/00; H01L23/04; H01L23/13; H01L23/31; H04R1/04; H04R19/00; H04R19/04
Foreign References:
| US20030092326A1 | 2003-05-15 | |||
| KR20190060158A | 2019-06-03 | |||
| KR20170126768A | 2017-11-20 | |||
| KR20150060469A | 2015-06-03 | |||
| KR20070042491A | 2007-04-23 |
Attorney, Agent or Firm:
E-BIRD INTERNATIONAL IP LAW FIRM (KR)
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